Gray Silicone Sealant for Electronics

Grey Silicone Encapsulant for ElectronicsDescription of Grey Silicone Encapsulant for Electronics:RTV160 is a two-component room temperature cure potting compound with mix ratio of 1: 1, curing time can be accelerated by heating up, features with good flow ability and flame resistance. It\'s suitable for encapsulating of LE

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Grey Silicone Encapsulant for Electronics

Grey Silicone Encapsulant for Electronics
Grey Silicone Encapsulant for Electronics
Description of Grey Silicone Encapsulant for Electronics:

RTV160 is a two-component room temperature cure potting compound with mix ratio of 1: 1, curing time can be accelerated by heating up, features with good flow ability and flame resistance. It's suitable for encapsulating of LED displayers, power module and electronics components, etc.

Features of Grey Silicone Encapsulant for Electronics:

Easy mix with 1: 1 proportion
Low viscosity, good flow ability
Room temperature cure or heat up cure
Thermal conduction, flame resistance
Without solvent

Using Instructions of Grey Silicone Encapsulant for Electronics:

1. Preparing: Clean up the coating surface, remove the rust, dust, oil dirt.

2. Pouring: Weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface after vacuum degassing.

3. Curing: Room temperature cure or heat-up cure is both workable.

4. It should be use up after open the package, the material must be kept in a cool place sealed well, and it should avoid from contact with moisture in the air.

Technical datasheetof Grey Silicone Encapsulant for Electronics:
Item No.RTV 160
Colorgrey
Mix Ratio1:1
Viscosity mPa.s 25C< 4000
Density g/cm31.57±0.02
Pot life min 25C30
Curing time  H24
Curing time with heat min 100C10
Hardness shore A55-60
Dielectric strength kv/mm 25C≥20
Volume resistivity DC500v Ω•cm3×10 15
Tensile strength Mpa≥0.6
Thermal conductivity w/m0.63
Temperature C-30-200
Item No. RTV 160
Color: Grey
Viscosity mPa. S 25C3000~6000
Density g/cm31.57± 0.02
Pot life min 25C30
Curing time H24
Curing time with heat min 100C10
Hardness shore A55~60
Dielectric strength kv/mm 25C≥ 20
Volume resistivity DC500V Ω Cm3× 1015
Tensile strength Mpa≥ 0.6
Thermal conductivity w/m0.58
Temperature C-30~200

Note: Mechanical and electrical performance data tested at 25° C 7 days after curing, relative humidity of 55%; All the tested data is average value.

Packaging of Silicone Rubber For Electronic Encapsulating&Potting

Packs are available in 20kg and 200kg per drum.

Storage & Transportation of Silicone Rubber For Electronic Encapsulating&Potting

1. Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
2. It can be stroked and transported as non-dangerous goods.

Should you have any question, please feel free to contact Ms Libby
 
 
 

 

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