JRF-BM800 RTV silicone adhesive sealant, has excellent resistance to cold-thermal changes, anti-stress properties, high low temperature resistance, at -60 ~ 200 ºC keep long-term elasticity and stability, anti-UV, anti-aging, and has excellent insulation, moisture resistance, shock resistance ,corona resistance, anti-leakage and chemical resistance properties. in line with the EU ROHS directive.
Application :
- high frequency head, set-top boxes bonding fixed
- moisture-proof and waterproof encapsulation of sophisticated electronic components
- LED Display module and pixel waterproof encapsulation
- suitable for small or thin layer thickness (potting generally less than 6 mm) electronic components, modules, optoelectronic display and potting protection of circuit board.
How to use :
1.cleaning : clean up the surface of an object which be potting, remove rust, dirt and grease, etc.
2.sizing : unscrew the cap , squeeze glue on the clean surface, make it a natural leveling.
3.curing : sealing parts be placed in the air, after the epidermis formation, and then from the surface to the internal curing process, within 24 hours (at room temperature and 55% relative humidity), silicone sealant will solidify 2 ~ 4mm depth, the curing depth increases gradually with the extension of time , due to deep curing , need for a long time, so suggest single component silicone sealant generally used for small electronic components and a thin layer potting, 6 mm thick sealant fully cured need more than 7 days .
Note: it is recommended that the thickness is thicker than 6 mm potting choose double component types .
Before and after curing technology parameter table
The above performance data were at 25 ºC, relative humidity of 55% measured 7 days after curing. Our company does not undertake relevant responsibilities for test conditions different or product improvement of data different .
Specification :
100 ml /pc , 100pc / carton
300 ml /pc
Application :
- high frequency head, set-top boxes bonding fixed
- moisture-proof and waterproof encapsulation of sophisticated electronic components
- LED Display module and pixel waterproof encapsulation
- suitable for small or thin layer thickness (potting generally less than 6 mm) electronic components, modules, optoelectronic display and potting protection of circuit board.
How to use :
1.cleaning : clean up the surface of an object which be potting, remove rust, dirt and grease, etc.
2.sizing : unscrew the cap , squeeze glue on the clean surface, make it a natural leveling.
3.curing : sealing parts be placed in the air, after the epidermis formation, and then from the surface to the internal curing process, within 24 hours (at room temperature and 55% relative humidity), silicone sealant will solidify 2 ~ 4mm depth, the curing depth increases gradually with the extension of time , due to deep curing , need for a long time, so suggest single component silicone sealant generally used for small electronic components and a thin layer potting, 6 mm thick sealant fully cured need more than 7 days .
Note: it is recommended that the thickness is thicker than 6 mm potting choose double component types .
Before and after curing technology parameter table
| Model No. | JRF-BM800 | JRF-BM800 | JRF-BM800 |
| Before Curing | |||
| Appearance | Transparency | White | Black |
| Viscosity(cps) | 5000~30000 | 5000~30000 | 5000~30000 |
| Relative Density(g/cm3) | 1.00~1.05 | 1.1~1.2 | 1.1~1.2 |
| Surface Dry Time(min) | 1.5-5 | 3-15 | 3-15 |
| Completely Cure Time (d) | 3~7 | 3~7 | 3~7 |
| Curing Type | Neutral | Neutral | Neutral |
| After Curing | |||
| Hardness (Shore A) | 25±5 | 25±5 | 25±5 |
| Tensile Strength(MPa) | ≥0.6 | ≥0.6 | ≥0.6 |
| Shear Strength(MPa) | ≥0.5 | ≥0.5 | ≥0.5 |
| Elongation(%) | 100~200 | 100~200 | 100~200 |
| Use Temperature (ºC) | -60~200 | -60~200 | -60~200 |
| Volume Resistivity (Ω·cm) | ≥5.0×1016 | ≥5.0×1016 | ≥5.0×1016 |
| Dielectric Strength (kV/·mm) | ≥20 | ≥20 | ≥20 |
| Dielectric Constant (1.2MHz) | 2.8 | 2.8 | 2.8 |
| Loss factor (1.2MHz) | 0.001 | 0.001 | 0.001 |
The above performance data were at 25 ºC, relative humidity of 55% measured 7 days after curing. Our company does not undertake relevant responsibilities for test conditions different or product improvement of data different .
Specification :
100 ml /pc , 100pc / carton
300 ml /pc